• Brand : Allen-Bradley
• Series : 2097
• AC input voltage : 80…132V rms single-phase (120V nom), 80…264V rms single-phase (240V nom), 80…264V rms three-phase (240V nom)
• AC input frequency : 48…62 Hz
• Main AC input current, Nom (0-pk) : 11.3 A
• Main AC input current, Nom (rms) : 13.9 A
• Integrated AC Line Filter : No
• Control power back-up input voltage : 20…26V DC
• Control power back-up input current, max. inrush : 30 A
• Control power back-up input current, nominal : 500 mA
• Continuous output current (rms) : 12.0 A
• Continuous output current (0-pk) : 17.0 A
• Peak output current (rms) : 36.0 A
• Peak output current (0-pk) : 50.9 A
• Continuous power output(240V nom or 120V ) : 3.00 kW
• Shunt on : 390V DC
• Shunt off : 375V DC
• Dimensions : 9.37 x 7.29 x 2.70 in (238 x 185 x 69.0 mm
• Weight : 4.2 lbs (1.9 kg)

The Allen-Bradley 2097-V33PR6-LM is a Kinetix 350 Single-Axis Etehrnet I/P drive. This Kinetix Drive features an AC input voltage requirement of 80-132VAC, 1-phase, 80-264VAC, 1-Phase and 80-264VAC, 3-Phase. It has continuous output current and power of 17.0 A and 3.0 kW respectively and features safe Torque-Off functionality, Overvoltage protection and short-circuit current protection.

The 2097-V33PR6-LM Kinetix drive is capable of integrating with MP and TL series drives and actuators as well as integrate with Allen-Bradley PanelView Operator Terminals or Human Machine Interface (HMI) devices, Allen-Bradley 1734 Point I/O remote I/O modules, MicroLogix 1400 Programmable Logic Controllers (PLC), CompactLogix and ControlLogix Programmable Automation Controllers (PAC).

For installation of the 2097-V33PR6-LM, appropriate mounting clearance on both sides of the drive is minimum of 3 milimeter or 0.12 inch while the top and bottom section of the drive requires 25 milimeter or 1-inch clearance. This minimum clearance must be followed to ensure air flow and ventilation. Depending on the installed accessories, the minimum clearances may increase.

For electrical noise reduction, it is also recommended to implement bonding wherein the metal chassis, assemblies and frames, shields and enclosures are connected to limit or minimize the effects of electromagnetic interference. It is ideal to install the drive in a subpanel that is zinc plated or paint free steel to improve the bond. Appropriate cautions must be applied when performing bonding as incorrect bonding may block direct return path which may force high-frequency energy to move into other parts of the enclosure, damaging other electronic components.